Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts

Importancia y uso:

5.1 This test method provides a way to detect contamination on printed wiring board fingers that affects the electrical performance of such fingers. Such contamination may arise during PWB manufacture, circuit assembly, or service life and may include solder mask, solder flux, hardened lubricants, dust, or other materials. This test method provides a nondestructive method of inspecting such fingers at any point in the life of the product including after original manufacture, after assembly of circuit components to the PWB, and after time in service such as when returned for repair. Because this test method uses two probes to finger contacts in series, it provides a sensitive test for contaminants that may increase electrical resistance when the fingers are plugged into an edgecard connector that typically makes contact to the finger through only one contact to finger interface.

5.2 Practice B667 describes a more general procedure for measuring contact resistance of any solid material in practically any geometrical form. The method in Practice B667 should be used for general studies and fundamental studies of electrical contact materials.

Subcomité:

B02.05

Volúmen:

02.04

Número ICS:

31.180 (Printed circuits and boards)

Palabras clave:

contact resistance; contamination; edgecard connector; printed wiring board fingers;