Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits

Importancia y uso:

4.1 This practice is useful as one method of controlling some electroplating solutions. It serves to indicate the presence of contamination or some other adverse condition.

4.2 Ductility measurements are of particular value when electroplated parts are to be subjected to moderate stress such as that involved in bolting an electroplated bumper to an automobile or when exposed to a wide range of fluctuating temperatures (thermal shock).

Subcomité:

B08.10

Referida por:

B0456-17R22, B0832-93R23

Volúmen:

02.05

Número ICS:

17.040.20 (Properties of surfaces), 25.220.40 (Metallic coatings)